Application Form / Exhibitor Contract

Cancellation of all or part of the exhibit space/packages for must be in written form. The exhibitor is liable for the following cancellation fees:

• Within 8 business days after confirmation by the organizer: no cancellation fee
• After this period: 25% of space rental fee.
• Less than six weeks prior to the show date: 100% space rental fee.

	1 Material Suppliers 1.1     Materials 1.1.1     Substrates 1.1.1.1     Plastic Films 1.1.1.2     Metal Foils 1.1.1.3     Paper 1.1.1.4     Glass 1.1.1.5     Textile 1.1.1.6     Others 1.1.2     Conductors 1.1.2.1     Organic 1.1.2.2     Inorganic 1.1.2.3     Nano Materials 1.1.2.4     Carbon Nanotubes 1.1.2.5     Hybrides 1.1.3     Semi-Conductors 1.1.3.1     Semi-Conductors 1.1.3.2     Polymer 1.1.3.3     Small Molecule 1.1.3.4     Inorganic 1.1.3.5     Nano Materials 1.1.3.6     Hybrides 1.1.4     Dielectrics 1.1.4.1     Organic 1.1.4.2     Inorganic 1.1.4.3     Nano Materials 1.1.4.4     Carbon Nanotubes 1.1.4.5     Hybrides 1.1.5     Encapsulation 1.1.5.1     Thin Film 1.1.5.2     Polymer Film 1.1.5.3     Metal 1.1.5.4     Glass 1.1.6     Others 1.2     Processes 1.2.1     Printing 1.2.1.1     Gravure 1.2.1.2     Offset 1.2.1.3     Screen 1.2.1.4     Flexographic 1.2.1.5     Others 1.2.2     Digital Printing 1.2.2.1     Ink-jet 1.2.2.2     Others 1.2.3     Other Printing Methods 1.2.3.1     Nano Imprint 1.2.4     Vacuum Processes 1.2.4.1     Evaporation 1.2.4.2     Sputtering 1.2.4.3     OVPD 1.2.5     Photolithography 1.2.6     Laser 1.2.6.1     Laser Ablation 1.2.6.2     Laser Transfer 1.2.7     Solution Coating 1.2.7.1     Spin Coating 1.2.7.2     Dip Coating 1.2.7.3     Blade Coating 1.2.7.4     Others 1.2.8     Encapsulation 1.2.8.1     Thin Film 1.2.8.2     Polymer Film 1.2.8.3     Metal 1.2.8.4     Glass 1.2.8.5     Others 1.2.9     Clean Room 1.2.10     Others 1.3     Devices 1.3.1     Transistors 1.3.2     Diodes 1.3.3     Passive Devices 1.3.3.1     Capacitors 1.3.3.2     Resistors 1.3.3.3     Others 1.3.4     Integrated Circuits 1.3.5     Displays 1.3.5.1     OLED 1.3.5.2     Electrophoretic 1.3.5.3     Electrochromic 1.3.5.4     Electroluminescent 1.3.5.5     LCD 1.3.5.6     Electrowetting 1.3.5.7     Others 1.3.6     Photovoltaic Cells 1.3.6.1     Organic 1.3.6.2     Hybride 1.3.6.3     Inorganic 1.3.7     Sensors 1.3.7.1     Photodiode 1.3.7.2     Pressure 1.3.7.3     Temperature 1.3.7.4     Gas 1.3.7.5     Others 1.3.8     Memory Elements 1.3.9     Antennas 1.3.10     Batteries 1.3.11     Others 1.4     Integration 1.4.1     Electrical Contacting 1.4.1.1     Flip Chip 1.4.1.2     Others 1.4.2     Lamination 1.4.3     Integration into Packaging 1.4.4     Others 1.5     Test 1.5.1     Electrical Characterization 1.5.2     Physical / Optical Characterization 1.5.3     Simulation / Cicuit Optimization 1.5.4     Lifetime Testing 1.5.5     Environmantal Testing 1.5.6     Quality / Process Control 1.5.7     Chemical Characterization 1.5.8     Others 1.6     Applications 1.6.1     RFID 1.6.2     TFT Backplanes 1.6.3     Displays 1.6.4     Sensors 1.6.5     Smart Objects 1.6.6     Solar Cells 1.6.7     Smart Textiles 1.6.8     Speakers 1.6.9     Lighting 1.6.10     Others 1.7     Miscellaneous 1.7.1     Consulting 1.7.2     R & D Funding Management 1.7.3     R & D 2 Equipment Manufacturers 2.1     Materials 2.1.3     Substrates 2.1.3.1     Plastic Films 2.1.3.2     Metal Foils 2.1.3.3     Paper 2.1.3.4     Glass 2.1.3.5     Textile 2.1.3.6     Others 2.1.4     Conductors 2.1.4.1     Organic 2.1.4.2     Inorganic 2.1.4.3     Nano Materials 2.1.4.4     Carbon Nanotubes 2.1.4.5     Hybrides 2.1.5     Semi-Conductors 2.1.5.1     Polymer 2.1.5.2     Small Molecule 2.1.5.3     Inorganic 2.1.5.4     Nano Materials 2.1.5.5     Hybrides 2.1.6     Dielectrics 2.1.6.1     Organic 2.1.6.2     Inorganic 2.1.6.3     Nano Materials 2.1.6.4     Carbon nanotubes 2.1.6.5     Hybrides 2.1.7     Encapsulation 2.1.7.1     Thin Film 2.1.7.2     Polymer Film 2.1.7.3     Metal 2.1.7.4     Glass 2.1.8     Others 2.2     Processes 2.2.3     Printing 2.2.3.1     Gravure 2.2.3.2     Offset 2.2.3.3     Screen 2.2.3.4     Flexographic 2.2.3.5     Other 2.2.4     Digital Printing 2.2.4.1     Ink-jet 2.2.4.2     Others 2.2.5     Other Printing Methods 2.2.5.1     Nano Imprint 2.2.6     Vacuum Processes 2.2.6.1     Evaporation 2.2.6.2     Sputtering 2.2.6.3     OVPD 2.2.7     Photolithography 2.2.8     Laser 2.2.8.1     Laser Ablation 2.2.8.2     Laser Transfer 2.2.9     Solution Coating 2.2.9.1     Spin Coating 2.2.9.2     Dip Coating 2.2.9.3     Blade Coating 2.2.9.4     Others 2.2.10     Encapsulation 2.2.10.1     Thin Film 2.2.10.2     Polymer Film 2.2.10.3     Metal 2.2.10.4     Glass 2.2.10.5     Others 2.2.11     Clean Room 2.2.12     Others 2.3     Devices 2.3.3     Transistors 2.3.4     Diodes 2.3.5     Passive Devices 2.3.5.1     Capacitors 2.3.5.2     Resistors 2.3.5.3     Others 2.3.6     Integrated Circuits 2.3.7     Displays 2.3.7.1     OLED 2.3.7.2     Electrophoretic 2.3.7.3     Electrochromic 2.3.7.4     Electroluminescent 2.3.7.5     LCD 2.3.7.6     Electrowetting 2.3.7.7     Others 2.3.8     Photovoltaic Cells 2.3.8.1     Organic 2.3.8.2     Hybride 2.3.8.3     Inorganic 2.3.9     Sensors 2.3.9.1     Photodiode 2.3.9.2     Pressure 2.3.9.3     Temperature 2.3.9.4     Gas 2.3.9.5     Others 2.3.10     Memory Elements 2.3.11     Antennas 2.3.12     Batteries 2.3.13     Metering Pumps 2.3.14     Others 2.4     Integration 2.4.3     Electrical Contacting 2.4.3.1     Flip Chip 2.4.3.2     Other 2.4.4     Lamination 2.4.5     Integration into Packaging 2.4.6     Others 2.5     Test 2.5.3     Electrical Characterization 2.5.4     Physical / Optical Characterization 2.5.5     Simulation / Cicuit Optimization 2.5.6     Lifetime testing 2.5.7     Environmantal Testing 2.5.8     Quality / Process Control 2.5.9     Chemical Characterization 2.5.10     Others 2.6     Applications 2.6.3     RFID 2.6.4     TFT Backplanes 2.6.5     Displays 2.6.6     Sensors 2.6.7     Smart Objects 2.6.8     Solar Cells 2.6.9     Smart Textiles 2.6.10     Speakers 2.6.11     Lighting 2.6.12     Others 2.7     Miscellaneous 2.7.3     Consulting 2.7.4     R & D Funding Management 2.7.5     R & D 3 Device Manufacturers 3.1     Materials 3.1.1     Substrates 3.1.1.1     Plastic Films 3.1.1.2     Metal Foils 3.1.1.3     Paper 3.1.1.4     Glass 3.1.1.5     Paper 3.1.1.6     Glass 3.1.1.7     Textile 3.1.1.8     Others 3.1.2     Conductors 3.1.2.1     Organic 3.1.2.2     Inorganic 3.1.2.3     Nano Materials 3.1.2.4     Carbon Nanotubes 3.1.2.5     Hybrides 3.1.3     Semi-Conductors 3.1.3.1     Polymer 3.1.3.2     Small Molecule 3.1.3.3     Inorganic 3.1.3.4     Nano Materials 3.1.3.5     Hybrides 3.1.4     Dielectrics 3.1.4.1     Organic 3.1.4.2     Inorganic 3.1.4.3     Nano Materials 3.1.4.4     Carbon Nanotubes 3.1.4.5     Hybrides 3.1.5     Encapsulation 3.1.5.1     Thin Film 3.1.5.2     Polymer Film 3.1.5.3     Metal 3.1.5.4     Glass 3.1.6     Others 3.2     Processes 3.2.3     Printing 3.2.3.1     Gravure 3.2.3.2     Offset 3.2.3.3     Screen 3.2.3.4     Flexographic 3.2.3.5     Other 3.2.4     Digital Printing 3.2.4.1     Ink-jet 3.2.4.2     Others 3.2.5     Other Printing Methods 3.2.5.1     Nano Imprint 3.2.6     Vacuum Processes 3.2.6.1     Evaporation 3.2.6.2     Sputtering 3.2.6.3     OVPD 3.2.7     Photolithography 3.2.8     Laser 3.2.8.1     Laser Ablation 3.2.8.2     Laser Transfer 3.2.9     Solution Coating 3.2.9.1     Spin Coating 3.2.9.2     Dip Coating 3.2.9.3     Blade Coating 3.2.9.4     Others 3.2.10     Encapsulation 3.2.10.1     Thin Film 3.2.10.2     Polymer Film 3.2.10.3     Metal 3.2.10.4     Glass 3.2.10.5     Others 3.2.11     Clean Room 3.2.12     Others 3.3     Devices 3.3.3     Transistors 3.3.4     Diodes 3.3.5     Passive Devices 3.3.5.1     Capacitors 3.3.5.2     Resistors 3.3.5.3     Others 3.3.6     Integrated Circuits 3.3.7     Displays 3.3.7.1     OLED 3.3.7.2     Electrophoretic 3.3.7.3     Electrochromic 3.3.7.4     Electroluminescent 3.3.7.5     LCD 3.3.7.6     Electrowetting 3.3.7.7     Others 3.3.8     Photovoltaic Cells 3.3.8.1     Organic 3.3.8.2     Hybride 3.3.8.3     Inorganic 3.3.9     Sensors 3.3.9.1     Photodiode 3.3.9.2     Pressure 3.3.9.3     Temperature 3.3.9.4     Gas 3.3.9.5     Others 3.3.10     Memory Elements 3.3.11     Antennas 3.3.12     Batteries 3.3.13     Others